The chipset's CPU is based on ARM's new Cortex-X2, Cortex-A710 and Cortex-A510 cores. Respectively, these core clusters are 1x Kryo Prime GHz, 3x Kryo Gold GHz and 4x Kryo Silver GHz. The Adreno 730 GPU, clocked at 818 MHz, takes care of graphically-intensive tasks. The whole chip is based on Samsung's 4nm 4LPE manufacturing process promising further power savings from last year's Snapdragon 888 series.Īnd while there's a wide variety of memory options, the Pro version for the global market only comes with 16GB/256GB or 16GB/512GB. GeekBench 5 (multi-core)ģDMark Wild Life Vulkan 1.1 (offscreen 1440p) Of course, we ran the usual benchmarks to see how the device holds against the competition and to check if there are any inconsistencies due to poor hardware implementations. In the CPU-heavy tests, such as Geekbench, the new SoC from Qualcomm seems to be doing a better job than the competition from Samsung in both single and multi-threaded scenarios. In combined workloads like AnTuTu 9, the Snapdragon 8 Gen 1 takes a more significant lead over the Exynos 2200 and its predecessor. Then it's no surprise that in the GPU-bound, the Adreno 730 dominates, and Samsung needs to work a bit more on its new Xclipse GPU co-developed with AMD. This is arguably the most important aspect of a gaming smartphone. Frames and horsepower don't matter if you aren't able to keep up the high performance for longer periods of time. Flagship chipsets from the last couple of years are notorious for overheating, and nubia addresses this with a conventional active cooling design. Although the word conventional might apply to a gaming PC, it's definitely unique in the smartphone realm.Īs we already mentioned, the Pro option skips one of the vents on the side and relies only on the back intake grille, and the side exhaust vent placed right next to the fan. The latter caps at 20,000 RPM and features a metal cover that reduces sound emissions. In addition to the unorthodox air cooling solution, nubia has applied "space-grade materials" for additional heat dissipation. This includes a graphene composite layer, aircraft-grade aluminum for the middle frame, a copper coil and a big vapor chamber attached to it. All of this is attached to the chip using a high thermal conductivity gel.Īs usual, we ran an hour-long CPU stress test that consisted of 100% load on all eight cores. CPU is usually the main contributor to the heat, so we test it using a CPU throttling app. We started off with 60-minutes long stress test without the cooling fan.
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